after the release of the the

in 2012 MacBook product line, ifixit say about that first brought the dismantling map of the MacBook Air, Apple’s design is quite simple, and therefore the dismantling process is not complex, on the body design change is very small compared to the previous generation, the new MagSafe is perhaps the greatest change. Disassembled parts, we can find the presence of SandForce SATA-III controller and Toshiba flash memory chips, USB 3.0 port and the left side of the microphone is a different point. Figure:

Apple’s latest release of the MacBook Air is designed based on Intel processors Ivy Bridge with the previous generation of products is largely the same, but a small number of changes, including a redesign of the flash modules connected device.

The appearance of the

the new MacBook Air with the previous generation of products. iFixit found that it is equipped with a Toshiba flash memory module, but with a new design of the SandForce the SATA-III controller chip.

other changes of the the

the MacBook Air is relatively much smaller. For example, the identity of this ultra-thin and light notebooks side marker interface from the interface to the right of transfer to the left.

The

new 13-inch MacBook Air A1466 the left side is also equipped with a new, relatively smaller MagSafe2 power adapter, a USB 3.0 interface and a headphone jack. The left side also includes a new microphone.

the

new MacBook Air is equipped with Intel’s Ivy Bridge chip, the thermal management capabilities of the notebook computer is the same as last year. Apple said that the radiator of ultra-low voltage chip to prove the efficiency of modern processors.

the

the new MacBook Air is also equipped with the previous generation Broadcom BCM4322 Intesifi, single-chip 802.11n Wi-Fi receiver and support for Bluetooth low-power Broadcom BCM20702 single-chip Bluetooth 4.0 processor. The proprietary design of the stereo speaker design is also released in 2011 and 2010 models.

the the

new MacBook Air and the similarities of the previous generation of products, there are many, the location of some components have been some changes.

the the

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(This article Source: cnbeta)
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